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EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

40X (0.2)

40X (0.6)

(

) TYP

VIA

0.2

36X (0.4)

(3.8)

(5.8)

4X

(1.1)

(4.7)

(R

) TYP

0.05

(2.7)

2X (2.1)

6X (0.75)

WQFN - 0.8 mm max height

RNQ0040A

PLASTIC QUAD FLATPACK - NO LEAD

4222125/B 01/2016

SYMM

1

8

9

20

21

28

29

40

SYMM

LAND PATTERN EXAMPLE

SCALE:15X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)