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M41T93RMY6F датащи(PDF) 43 Page - STMicroelectronics |
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M41T93RMY6F датащи(HTML) 43 Page - STMicroelectronics |
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43 / 56 page ![]() DocID12615 Rev 8 43/56 M41T93 Maximum ratings 56 4 Maximum ratings Stressing the device above the rating listed in the “absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 15. Absolute maximum ratings Symbol Parameter Value(1) Unit TSTG Storage temperature (VCC off, oscillator off) –55 to 125 °C VCC Supply voltage –0.3 to 7.0 V TSLD(2) Lead solder temperature for 10 seconds 260 °C VIO Input or output voltages –0.2 to Vcc+0.3 V IO Output current 20 mA PD Power dissipation 1 W JA Thermal resistance, junction to ambient QFN16 35.7 °C/W SOX18 1. Data based on characterization results, not tested in production. 2. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds (according to JEDEC J-STD-020D). |
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