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SPC560D30L3 датащи(PDF) 41 Page - STMicroelectronics

номер детали SPC560D30L3
подробное описание детали  32-bit MCU family built on the Power Architecture for automotive body electronics applications
PDF  82 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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SPC560D30L3 датащи(HTML) 41 Page - STMicroelectronics

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SPC560D30x, SPC560D40x
Electrical characteristics
77
capacitor. It is further split into four main domains to ensure noise isolation between
critical LV modules within the device:
LV_COR: Low voltage supply for the core. It is also used to provide supply for
FMPLL through double bonding.
LV_CFLA: Low voltage supply for code flash module. It is supplied with dedicated
ballast and shorted to LV_COR through double bonding.
LV_DFLA: Low voltage supply for data flash module. It is supplied with dedicated
ballast and shorted to LV_COR through double bonding.
LV_PLL: Low voltage supply for FMPLL. It is shorted to LV_COR through double
bonding.
Figure 7. Voltage regulator capacitance connection
The internal voltage regulator requires external capacitance (CREGn) to be connected to the
device in order to provide a stable low voltage digital supply to the device. Capacitances
should be placed on the board as near as possible to the associated pins. Care should also
be taken to limit the serial inductance of the board to less than 5 nH.
Each decoupling capacitor must be placed between each of the three VDD_LV/VSS_LV supply
pairs to ensure stable voltage (see Section 4.5: Recommended operating conditions).
DEVICE
VSS_LV
VDD_BV
VDD_LV
VSS_LV
VDD_LV
VDD
VSS_LV
VDD_LV
CREG2 (LV_COR/LV_CFLA)
CREG3
CDEC2
DEVICE
VDD_BV
I
VDD_LVn
VREF
VDD
Voltage Regulator
VSS
VSS_LVn
(supply/IO decoupling)
(LV_COR/LV_PLL)



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