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CSD87331Q3D датащи(PDF) 10 Page - Texas Instruments

номер детали CSD87331Q3D
подробное описание детали  CSD87331Q3D Synchronous Buck NexFET™ Power Block
PDF  27 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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CSD87331Q3D датащи(HTML) 10 Page - Texas Instruments

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CSD87331Q3D
SLPS283B – SEPTEMBER 2011 – REVISED FEBRUARY 2017
www.ti.com
Product Folder Links: CSD87331Q3D
Submit Documentation Feedback
Copyright © 2011–2017, Texas Instruments Incorporated
6 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
6.1 Application Information
6.1.1 Equivalent System Performance
Many of today’s high-performance computing systems require low power consumption in an effort to reduce
system operating temperatures and improve overall system efficiency. This has created a major emphasis on
improving the conversion efficiency of today’s synchronous buck topology. In particular, there has been an
emphasis in improving the performance of the critical power semiconductor in the power stage of this application
(see Figure 28). As such, optimization of the power semiconductors in these applications, needs to go beyond
simply reducing RDS(ON).
Figure 28. Equivalent System Schematic
The CSD87331Q3D is part of TI’s power block product family which is a highly optimized product for use in a
synchronous buck topology requiring high current, high efficiency, and high frequency. It incorporates TI’s latest
generation silicon which has been optimized for switching performance, as well as minimizing losses associated
with QGD, QGS, and QRR. Furthermore, TI’s patented packaging technology has minimized losses by nearly
eliminating parasitic elements between the control FET and sync FET connections (see Figure 29). A key
challenge solved by TI’s patented packaging technology is the system level impact of Common Source
Inductance (CSI). CSI greatly impedes the switching characteristics of any MOSFET which in turn increases
switching losses and reduces system efficiency. As a result, the effects of CSI need to be considered during the
MOSFET selection process. In addition, standard MOSFET switching loss equations used to predict system
efficiency need to be modified in order to account for the effects of CSI. Further details behind the effects of CSI
and modification of switching loss equations are outlined in Power Loss Calculation With Common Source
Inductance Consideration for Synchronous Buck Converters (SLPA009).



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