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CSD87331Q3D датащи(PDF) 2 Page - Texas Instruments

номер детали CSD87331Q3D
подробное описание детали  CSD87331Q3D Synchronous Buck NexFET™ Power Block
PDF  27 Pages
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CSD87331Q3D датащи(HTML) 2 Page - Texas Instruments

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CSD87331Q3D
SLPS283B – SEPTEMBER 2011 – REVISED FEBRUARY 2017
www.ti.com
Product Folder Links: CSD87331Q3D
Submit Documentation Feedback
Copyright © 2011–2017, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Specifications......................................................... 3
5.1
Absolute Maximum Ratings ...................................... 3
5.2
Recommended Operating Conditions ....................... 3
5.3
Power Block Performance ........................................ 3
5.4
Thermal Information .................................................. 3
5.5
Electrical Characteristics........................................... 4
5.6
Typical Power Block Device Characteristics............. 5
5.7
Typical Power Block MOSFET Characteristics......... 7
6
Application and Implementation ........................ 10
6.1
Application Information............................................ 10
6.2
Typical Application .................................................. 13
7
Layout ................................................................... 15
7.1
Layout Guidelines ................................................... 15
7.2
Layout Example ...................................................... 16
8
Device and Documentation Support.................. 17
8.1
Documentation Support .......................................... 17
8.2
Receiving Notification of Documentation Updates.. 17
8.3
Community Resources............................................ 17
8.4
Trademarks ............................................................. 17
8.5
Electrostatic Discharge Caution .............................. 17
8.6
Glossary .................................................................. 17
9
Mechanical, Packaging, and Orderable
Information ........................................................... 18
9.1
Q3D Package Dimensions ...................................... 18
9.2
Land Pattern Recommendation .............................. 19
9.3
Q3D Tape and Reel Information ............................. 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (January 2012) to Revision B
Page
Added note for IDM in the Absolute Maximum Ratings table .................................................................................................. 3
Added Application and Implementation section note ........................................................................................................... 10
Changed Recommended PCB Design Overview section to Layout section ........................................................................ 15
Added the Device and Documentation Support section....................................................................................................... 17
Changes from Original (September 2011) to Revision A
Page
Added Feature Bullet: Up to 15 A Operation. ........................................................................................................................ 1



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