0

5

10

15

20

0

20

40

60

80

100

120

140

Board Temperature (ºC)

0

5

10

15

20

0

10

20

30

40

50

60

70

80

90

Ambient Temperature (ºC)

400LFM

200LFM

100LFM

Nat Conv

0

5

10

15

20

0

10

20

30

40

50

60

70

80

90

Ambient Temperature (ºC)

400LFM

200LFM

100LFM

Nat Conv

0

0.5

1

1.5

2

2.5

3

3.5

4

1

3

5

7

9

11

13

15

Output Current (A)

0.4

0.5

0.6

0.7

0.8

0.9

1

1.1

1.2

1.3

1.4

−50

−25

0

25

50

75

100

125

150

Junction Temperature (ºC)

5

CSD87331Q3D

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SLPS283B – SEPTEMBER 2011 – REVISED FEBRUARY 2017

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5.6 Typical Power Block Device Characteristics

Test conditions: VIN = 12 V, VDD = 5 V, ƒSW = 500 kHz, VOUT = 1.3 V, LOUT = 1 µH, IOUT = 15 A, TJ = 125°C, unless stated

otherwise.

Figure 1. Power Loss vs Output Current

Figure 2. Power Loss vs Temperature

Figure 3. Safe Operating Area – PCB Vertical Mount(1)

Figure 4. Safe Operating Area – PCB Horizontal Mount(1)

Figure 5. Typical Safe Operating Area(1)

(1)

The typical power block system characteristic curves are based on measurements made on a PCB design with

dimensions of 4 in (W) × 3.5 in (L) × 0.062 in (H) and 6 copper layers of 1-oz copper thickness. See Application and

Implementation section for detailed explanation.