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AMC7836IPAPRG4 датащи(PDF) 90 Page - Texas Instruments |
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AMC7836IPAPRG4 датащи(HTML) 90 Page - Texas Instruments |
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90 / 91 page ![]() www.ti.com EXAMPLE STENCIL DESIGN ( 7) BASED ON 0.125 THICK STENCIL 60X (0.5) 64X (1.5) 64X (0.3) (R0.05) TYP (11.4) (11.4) PowerPAD TQFP - 1.2 mm max height PAP0064G PLASTIC QUAD FLATPACK 4218924/A 01/2022 5.92 X 5.92 0.175 6.39 X 6.39 0.15 7.0 X 7.0 (SHOWN) 0.125 7.83 X 7.83 0.1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:6X SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES SYMM SYMM BY SOLDER MASK METAL COVERED 64 49 17 32 33 48 1 16 65 |
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