6

LM5035C

SNVS631D – JANUARY 2010 – REVISED OCTOBER 2016

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Copyright © 2010–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN to GND

–0.3

105

V

HS to GND

–1

105

V

HB to GND

–0.3

118

V

HB to HS

–0.3

18

V

VCC to GND

–0.3

16

V

RT, DLY to GND

–0.3

5.5

V

COMP input current

10

mA

CS

1

V

All other inputs to GND

–0.3

7

V

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±250

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is intended to be functional. For ensured specifications and test conditions, see Electrical Characteristics.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

VIN voltage

13

105

V

External voltage applied to VCC

8

15

V

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

LM5035C

UNIT

PWP (HTSSOP)

NHZ (WQFN)

20 PINS

24 PINS

RθJA

Junction-to-ambient thermal resistance

35.9

31.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

19.8

25

°C/W

RθJB

Junction-to-board thermal resistance

16.7

9.9

°C/W

ψJT

Junction-to-top characterization parameter

0.4

0.2

°C/W

ψJB

Junction-to-board characterization parameter

16.6

10.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.6

1.6

°C/W