4

LM2743

SNVS276I – APRIL 2004 – REVISED FEBRUARY 2019

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Copyright © 2004–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

6 Specifications

6.1 Absolute Maximum Ratings

MIN

MAX

UNIT

VCC

–0.3

7

V

BOOT voltage

–0.3

21

V

ISEN

–0.3

9.5

V

All other pins

–0.3

VCC + 0.3

V

TJ

Junction temperature

150

°C

Soldering information

Lead temperature (soldering, 10 s)

260

°C

Infrared or convection (20 s)

235

°C

Tstg

Storage temperature

–65

150

°C

(1)

The human body model is a 100 pF capacitor discharged through a 1.5-k

Ω resistor into each pin.

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge(1)

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(2)

2000

V

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VCC

Supply voltage range

3

6

V

TJ

Junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LM2743

UNIT

TSSOP (PW)

14 PINS

RθJA

Junction-to-ambient thermal resistance

107.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

33.7

°C/W

RθJB

Junction-to-board thermal resistance

50.7

°C/W

ψJT

Junction-to-top characterization parameter

1.8

°C/W

ψJB

Junction-to-board characterization parameter

50

°C/W