TBD datasheet(28/80 Pages) FREESCALE

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MSC8144E Quad Core Digital Signal Processor Data Sheet, Rev. 6

Electrical Characteristics

Freescale Semiconductor

2.4

Thermal Characteristics

Table 5 describes thermal characteristics of the MSC8144E for the FC-PBGA packages.

2.5

Power Characteristics

The estimated typical power dissipation for MSC8144E versus the core frequency is shown in Table 6.

The typical power values were measured using an EFR code with the device running at a junction temperature of 25°C. No

peripherals were enabled and the ICache was not enabled. The source code was optimized to use all the ALUs and AGUs and

Table 5. Thermal Characteristics for the MSC8144E

Characteristic

Symbol

FC-PBGA

× 29 mm5

Unit

Natural

Convection

200 ft/min

(1 m/s) airflow

Junction-to-ambient1, 2

RθJA

°C/W

Junction-to-ambient, four-layer board1, 3

RθJA

°C/W

Junction-to-board (bottom)4

RθJB

°C/W

Junction-to-case5

RθJC

0.8

°C/W

Notes:

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on

the top surface of the board near the package.

Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL

SPEC-883 Method 1012.1) with the calculated case temperature.

Table 6. Power Dissipation

Extended Core Frequency

Core Frequency

Typical

Unit

266

400

TBD

533

TBD

667

TBD

800

TBD

333

500

TBD

667

TBD

833

TBD

1000

TBD

400

TBD

600

TBD

800

TBD

1000

TBD

500

TBD

750

TBD

1000

TBD

Note:

Measured for 1.0 V core at 25°C junction temperature.

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