ISL70001SEH, ISL70001SRH

FN7956 Rev 3.03

Page 21 of 23

Feb 5, 2024

Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that

you have the latest revision.

DATE

REVISION

CHANGE

Feb 5, 2024

3.03

Applied Not Recommended for New Design stamp.

Updated the ordering Information table.

Sep 16, 2022

3.02

Updated the following specifications:

Upper Device rDS(ON)

-Changed min from 122 to 125mΩ

-Changed typ from 215 to 162mΩ

-Changed max from 346 to 210mΩ

-Added two more rows for different temperatures.

Lower Device rDS(ON)

-Changed min from 77 to 82mΩ

-Changed typ from 146 to 115mΩ

-Changed max from 236 to 145mΩ

-Added two more rows for different temperatures.

Apr 15, 2021

3.01

Updated Radiation acceptance features bullets.

Updated Ordering information table by adding standard notes and Rad Assurance testing values.

Updated Switching Frequency/Synchronization section.

Removed About Intersil section.

Feb 22, 2016

3.00

Added text after 2nd paragraph on page 1.

Clarified the package vs die pad name (AGND vs PGND) differences and how to use them in the Pin

Assignments section.

Updated Ordering Information by removing the ISL70001ASEH evaluation board.

Feb 24, 2014

2.00

Added Note 13 on page 11.

Added Note 14 on page 11.

Removed MSL note from the ordering information on page 2 as it is not applicable to hermetic packages.

Added Note 2 for ordering information table on page 6.

Added ISL70001SRH throughout datasheet.

page 6: Added ISL70001SRHQF and ISL70001SRHVX to the ordering information table.

May 20, 2013

1.00

Added heat sink mounting guidelines on page 18.

Added “Weight Characteristics” on page 18.

Added label “Origin” to Metallization Mask Layout on page 19.

page 6, ordering information table: Removed the word “(HEATSINK)” under the first column, and added to

rows 2 & 6 in the fourth column “48 ld CQFP with Heatsink”.

page 9, thermal information table: Changed note 6, from removed exposed metal pad to exposed metal

Heatsink.

Updated ordering information table on page 6 as follow: Added ISL7000SRHVF. Added “Heatsink” to help

distinguish between the two package types. Thermal Resistance on page 9 as follow: changed note 3 from

“low” to “high” effective” thermal conductivity test board type and added note 4 “direct attach”.

Page 2: Added ISL70001SEHVFE, ISL70001SEHFE/PROTO parts to ordering information table and added

Package DWG# column to table.

Added POD: R48.A and R48.

Nov 30, 2011

0.00

Initial Release