Bosch Sensortec

| BST-BMP585-DS003-02

5 | 71

© Bosch Sensortec GmbH 2023 | All rights reserved, also regarding any disposal, exploitation, reproduction, editing, distribution,

Document number: BST-BMP585-DS003-02

as well as in the event of applications for industrial property rights

8.30 Register (0x33) Out-of-range (OOR) threshold for pressure (MSB)................................................................... 58

8.31 Register (0x34) Out-of-range (OOR) range configuration .................................................................................. 59

8.32 Register (0x35) Out-of-range (OOR) configuration............................................................................................. 59

8.33 Register (0x36) Over-sampling rate (OSR) configuration................................................................................... 59

8.34 Register (0x37) Output data rate (ODR) configuration ....................................................................................... 60

8.35 Register (0x38) Effective over-sampling rate (OSR) configuration..................................................................... 61

8.36 Register (0x7E) Command Register................................................................................................................... 61

8.37 Register (0x7F) Register Map paging ctrl register .............................................................................................. 62

9 Package........................................................................................................................................................................ 63

9.1 BMP585 Package Outline Dimensions............................................................................................................... 63

9.1.1

Top View................................................................................................................................................. 63

9.1.2

Bottom View ........................................................................................................................................... 64

9.1.3

Side view ................................................................................................................................................ 65

9.2 Device Marking ................................................................................................................................................... 66

9.2.1

Mass Production Devices....................................................................................................................... 66

9.2.2

Engineering Samples ............................................................................................................................. 67

9.3 Moisture Sensitivity Level and Soldering ............................................................................................................ 67

9.3.1

MSL and device storage......................................................................................................................... 67

9.3.2

Soldering ................................................................................................................................................ 67

9.3.3

Landing pattern ...................................................................................................................................... 67

9.4 Environmental Safety.......................................................................................................................................... 68

9.4.1

RoHS...................................................................................................................................................... 68

9.4.2

Halogen content ..................................................................................................................................... 68

9.5 Internal Package Structure ................................................................................................................................. 68

11 Legal disclaimer.......................................................................................................................................................... 69

12 Document history and modification ......................................................................................................................... 70