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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADS1174IPAPR датащи(PDF) 28 Page - Texas Instruments |
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ADS1174IPAPR датащи(HTML) 28 Page - Texas Instruments |
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28 / 35 page  www.ti.com PowerPAD THERMALLY-ENHANCED ICDie WireBond WireBond LeadframeDiePad ExposedatBaseofPackage DieAttachEpoxy (thermallyconductive) Leadframe MoldCompount (Epoxy) ADS1174 ADS1178 SBAS373 – OCTOBER 2007 die pad to be attached to the PCB using standard PACKAGING flow soldering techniques. This soldering allows efficient attachment to the PCB and permits the board The PowerPAD concept is implemented in standard structure to be used as a heat-sink for the package. epoxy resin package material. The integrated circuit Using a thermal pad identical in size to the die pad is attached to the leadframe die pad using thermally and vias connected to the PCB ground plane, the conductive epoxy. The package is molded so that the board designer can now implement power packaging leadframe die pad is exposed at a surface of the without additional thermal hardware (for example, package. This exposure provides an extremely low external heat sinks) or the need for specialized thermal resistance to the path between the IC assembly instructions. junction and the exterior case. The external surface of the leadframe die pad is located on the printed Figure 29 illustrates a cross-section view of a circuit board (PCB) side of the package, allowing the PowerPAD package. Figure 29. Cross-Section View of a PowerPAD Thermally-Enhanced Package 28 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS1174 ADS1178 |
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