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ELANSC310 датащи(PDF) 72 Page - Advanced Micro Devices |
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ELANSC310 датащи(HTML) 72 Page - Advanced Micro Devices |
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72 / 119 page ![]() 72 Élan™SC310 Microcontroller Data Sheet PREL IMINARY THERMAL CHARACTERISTICS The ÉlanSC310 microcontroller is specified for operation with a case temperature range from 0°C to 85°C for a com- mercial device. Table 40 shows the thermal resistance for 208-pin QFP and TQFP packages. Table 40. Thermal Resistance (°C/Watt) ψ JT and θJA for 208-pin QFP and TQFP packages TYPICAL POWER NUMBERS Table 41 shows the typical power numbers that were measured for the ÉlanSC310 microcontroller. These measurements reflect the part when it is configured for Maximum ISA mode operation at operating speeds of 33 MHz, 25 MHz, and 9.2 MHz. The connection of the various power sections of the part are outlined in the table so that the designer may have some relative in- formation for the power consumption differences be- tween 3.3-V operation and 5-V operation. Please see the notes associated with the tables for specifics on the test conditions. Notes: 1. In normal operating mode measurements, the ÉlanSC310 microcontroller is running the LandMark Speedcom benchmark (Version 2.00). All CPU idle cycles are run at the high-speed rate. 2. In Doze mode, the Doze mode configuration is such that the low-speed CPU clock is programmed to turn on for 64 refresh cycles upon an IRQ0 (DOS timer) generation. After 64 refresh cycles, the low-speed CPU clock is turned off again. The IRQ0 timer is set for an approximate 55 ms interval and the refresh duty cycle is approximately 15.6 µs. In Doze mode, the high- speed PLL is always turned off and, in this case, the low-speed PLL and video PLLs are on to allow the IRQ0 periodic wake- up. 3. Suspend mode measurements were taken with DRAM refresh rate set at 8192 Hz (126 µs). 4. Micropower measurements were taken with DRAM unpowered and the DRAM refresh rate set at 8192 Hz. 5. These measurements were taken with the memory interface powered at 5 V, rather than 3.3 V. All measurements were obtained at typical room temperature (ambient). Package ψ JT θ JA vs. Airflow-Linear ft/min. (m/s) 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) QFP 4.7 33 26 25 23 22 TQFP 7 37.4 31.0 28.5 26.9 26.6 Table 41. Typical Maximum ISA Mode Power Consumption Power Pin Maximum ISA Mode Group Name Volts 33 MHz 25 MHz 9.2 MHz Doze2 Suspend3 µ Pwr Off4 CPU Core VCC 3.3 119 mA 94.3mA 39.1mA 6.12 mA 5.7 µA4.1 µA I/O VCC VCC1 5 5.55 mA 5.55mA 5.55mA 5.55 mA 0 µA OFF Analog AVCC 3.3 2.58 mA 2.36 mA 2.24 mA 1.39 mA 19.9 µA19.8 µA I/O VCC5 5 772 µA 680 µA 434 µA 293 µA0 µA OFF Memory VCCMEM 3.3 16.4 mA 12.6 mA 4.9 mA 190 µA 10.5 µA OFF Sub ISA Bus VCCSYS 5 16.8 mA 13.7 mA 7.76 mA 3.6 mA 0 µA OFF Full ISA Bus VCCSYS2 5 2.06 mA 1.57 mA 0.9 mA 21 µA0 µA OFF Total (mW) 582 mW 468mW 226mW 72.7 mW 0.12 mW 0.08 mW Memory5 VCCMEM 5 26.5 mA 20.3 mA 8.75 mA 304 µA 17 µA OFF Total (mW) 660 mW 528 mW 470 mW 73.6 mW 0.17 mW 0.08 mW |
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