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UT7R995C датащи(PDF) 9 Page - Aeroflex Circuit Technology |
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UT7R995C датащи(HTML) 9 Page - Aeroflex Circuit Technology |
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9 / 22 page ![]() 9 4PD/DIV I 3-Level Power down and reference divider control. This dual function pin controls the power down operation and selects the input reference divider. Holding the pin low during power up ensures clean RadClock startup that is independent of the behavior of the reference clock. The pin may also be driven low at any time to force a reset to the PLL. The following table summarizes the operating states controlled by the PD/DIV pin. PD/DIV Operating Mode Input Reference Divider LOW Powered Down N/A MID Normal Operation ÷ 2 HIGH Normal Operation ÷ 1 20 LOCK O LVTTL PLL lock indication signal. A HIGH state indicates that the PLL is in a locked condition. A LOW state indicates that the PLL is not locked and the outputs may not be synchronized to the input. As the following table indicates, the level of phase alignment between XTAL1 and FB that will cause the LOCK pin to change states is dependent upon the frequency range selected by the FS input. FS LOCK Resolution L 1.6ns typical M 1.6ns typical H 800ps typical ** Note: The LOCK pin can only be considered as a valid output when the RadClock is in a normal mode of operation (e.g. PD/DIV != LOW, TEST = LOW, and a valid reference clock is supplied to the XTAL1 input). Until these conditions are met, RadClock is not in a normal operating mode and the LOCK pin may be HIGH or LOW and therefore should not be used in making any logical decisions until the device is in a normal operating mode. Reference the tLOCK parameter in the AC timing specification to determine the delay for the LOCK pin to become valid HIGH following a stable input reference clock and the application of a clock to the FB input. 43 VDDQ4 2 PWR Power Power supply for Bank 4 output buffers. Please see Table 12 for supply level constraints. 7 VDDQ3 2 PWR Power Power supply for Bank 3 output buffers. Please see Table 12 for supply level constraints. 19, 30 VDDQ1 2 PWR Power Power supply for Bank 1 and Bank 2 output buffers. Please see Table 12 for supply level constraints. 6, 12, 14, 35, 38 VDD 2 PWR Power Power supply for internal circuitry. Please see Table 12 for supply level constraints. 10, 11, 15, 16, 21, 29, 33, 34, 39, 40, 44, 45 VSS PWR Power Ground Flatpack Pin No. Name I/O Type Description Notes: 1. When TEST = MID and sOE = HIGH, the PLL remains active with nF[1:0] = LL functioning as an output disable control for individual output banks. Skew selections remain in effect unless nF[1:0] = LL. 2. A bypass capacitor (0.1 μF) should be placed as close as possible to each positive power pin (<0.2"). An additional 1μF capacitor should be located within 0.2" of the output bank power supplies (VDDQ1, VDDQ3, and VDDQ4). If these bypass capacitors are not close to the pins, their high frequency filtering character- istics will be cancelled by the parasitic inductance of the traces. Additionally, it is recommend that wide traces (0.025" or wider) be used when connecting the decoupling capacitors to their respective power pins on the RadClock. |
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