ADA4945-1ACPZ-R7 datasheet(21/57 Pages) AD

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Data Sheet

ADA4945-1

analog.com

Rev. A

21 of 57

ABSOLUTE MAXIMUM RATINGS

TA = 25°C unless otherwise specified.

Table 10. Absolute Maximum Ratings

PARAMETER

RATING

Supply Voltage

11V

VOCM

±VS

Differential Input Voltage

±1V

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Electrostatic Discharge (ESD) Field Induced Charged Device Model

(FICDM)

1250V

Electrostatic Discharge (ESD)Human Body Model (HBM)

4000V

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product.

This is a stress rating only; functional operation of the product at these or any other conditions above those indicated

in the operational section of this specification is not implied. Operation beyond the maximum operating conditions

for extended periods may affect product reliability.

Thermal Resistance

Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful

attention to PCB thermal design is required.

θJA is the natural convection, junction to ambient, thermal resistance measured in a one cubic foot sealed

enclosure. θJC is the junction to case thermal resistance.

Table 11. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-16-22

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the ADA4945-1 package is limited by the associated rise in junction

temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the properties of the

plastic change. Even temporarily exceeding this temperature limit can change the stresses that the package exerts

on the die, permanently shifting the parametric performance of ADA4945-1. Exceeding a junction temperature of

150°C for an extended period can result in changes in the silicon devices, potentially causing failure.

The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in

the package due to the load drive for all outputs. The quiescent power dissipation is the voltage between the supply

pins (±VS) times the quiescent current (Iq). The load current consists of the differential and common-mode currents

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