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LTC2415-1IGN датащи(PDF) 31 Page - Linear Technology |
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LTC2415-1IGN датащи(HTML) 31 Page - Linear Technology |
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31 / 40 page ![]() LTC2415/LTC2415-1 31 sn2415 24151fs APPLICATIO S I FOR ATIO Figure 29. INL vs Differential Input Voltage (VIN = IN+ – IN–) and Reference Source Resistance (RSOURCE at REF+ and REF– for Large CREF Values (CREF ≥ 1µF) VINDIF/VREFDIF –0.5 –0.4–0.3–0.2–0.1 0 0.1 0.2 0.3 0.4 0.5 15 12 9 6 3 0 –3 –6 –9 –12 –15 VCC = 5V REF+ = 5V REF– = GND VINCM = 0.5 • (IN + + IN–) = 2.5V FO = GND CREF = 10µF TA = 25°C RSOURCE = 1000Ω RSOURCE = 500Ω RSOURCE = 100Ω 2415 F29 tance is 1.43M Ω. When FO is driven by an external oscillator with a frequency fEOSC (external conversion clock operation), the typical differential reference resis- tance is 0.20 • 1012/fEOSCΩ and each ohm of source resistance driving REF+ or REF– will result in 2.47 • 10–6 • fEOSCppm gain error. The effect of the source resistance on the two reference pins is additive with respect to this gain error. The typical +FS and –FS errors for various combinations of source resistance seen by the REF+ and REF– pins and external capacitance CREF connected to these pins are shown in Figures 25, 26, 27 and 28. In addition to this gain error, the converter INL perfor- mance is degraded by the reference source impedance. When FO = LOW (internal oscillator and 60Hz notch), every 100 Ωof source resistance driving REF+ or REF– translates into about 1.34ppm additional INL error. For the LTC2415, when FO = HIGH (internal oscillator and 50Hz notch), every 100 Ωof source resistance driving REF+ or REF– translates into about 1.1ppm additional INL error; and for the LTC2415-1 operating with simultaneous 50Hz/60Hz re- jection, every 100 Ω of source resistance leads to an additional 1.22ppm of additional INL error. When FO is driven by an external oscillator with a frequency fEOSC, every 100 Ω of source resistance driving REF+ or REF– translates into about 8.73 • 10–6 • fEOSCppm additional INL error. Figure 26 shows the typical INL error due to the source resistance driving the REF+ or REF– pins when large CREF values are used. The effect of the source resistance on the two reference pins is additive with respect to this INL error. In general, matching of source impedance for the REF+ and REF– pins does not help the gain or the INL error. The user is thus advised to minimize the combined source impedance driving the REF+ and REF– pins rather than to try to match it. The magnitude of the dynamic reference current depends upon the size of the very stable internal sampling capaci- tors and upon the accuracy of the converter sampling clock. The accuracy of the internal clock over the entire temperature and power supply range is typical better than 0.5%. Such a specification can also be easily achieved by an external clock. When relatively stable resistors (50ppm/ °C) are used for the external source impedance seen by REF+ and REF–, the expected drift of the dynamic current gain error will be insignificant (about 1% of its value over the entire temperature and voltage range). Even for the most stringent applications a one-time calibration operation may be sufficient. In addition to the reference sampling charge, the reference pins ESD protection diodes have a temperature dependent leakage current. This leakage current, nominally 1nA ( ±10nA max), results in a small gain error. A 100Ω source resistance will create a 0.05 µV typical and 0.5µV maxi- mum full-scale error. |
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