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DESCRIPTION, CONTINUED

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

THS7347

SLOS531 – MAY 2007

As part of the THS7347 flexibility, the device input can be selected for ac- or dc-coupled inputs. The ac-coupled

channels without sync. The dc input options include a dc input or a dc+Offset shift to allow for a full sync

dynamic range at the output with 0 V input.

The THS7347 is available in a lead-free, RoHS-compliant TQFP package.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

PACKAGED DEVICES

PACKAGE TYPE

TRANSPORT MEDIA, QUANTITY

THS7347IPHP

Tray, 250

HTQFP-48 PowerPAD™

THS7347IPHPR

Tape and reel, 1000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

THS7347

UNIT

5.5

V

Input voltage

V

Continuous output current

±80

mA

Continuous power dissipation

See Dissipation Rating Table

+150

°C

+125

°C

Storage temperature range

–65 to +150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

HBM

1500

V

ESD ratings

CDM

1500

V

MM

100

V

(1)

Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.

(2)

The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.

(3)

The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this

temperature may result in reduced reliability and/or lifetime of the device.

θ

JC

θ

JA

PACKAGE

(

°C/W)

(

°C/W)

HTQFP-48 with PowerPAD (PHP)

1.2

35

2.85 W

1.14 W

(1)

This data was taken with a PowerPAD standard 3-inch by 3-inch, 4-layer printed circuit board (PCB) with internal ground plane

connections to the PowerPAD.

(2)

Power rating is determined with a junction temperature of +125

°C. This temperature is the point where distortion starts to substantially

increase and long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction

temperature at or below +125

°C for best performance and reliability.

2

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