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BL702/704/706 датащи(PDF) 34 Page - Bouffalo Lab Intelligent Technology Co., Ltd. |
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BL702/704/706 датащи(HTML) 34 Page - Bouffalo Lab Intelligent Technology Co., Ltd. |
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34 / 47 page ![]() 7 Product use 7.1 Moisture Sensitivity Level(MSL) The moisture sensitivity level of the chip is: MSL3. After the vacuum package is opened, it needs to be used up within 168 hours (7 days) at ≤30°C/60%RH, otherwise it needs to be baked and put online. For baking temperature and time, please refer to IPC/JEDECJ-STD-033B01. Table 7.1: Reference Conditions for Drying Mounted or Unmounted SMD Packages (User Bake: Floor life begins counting at time = 0 after bake) Package Body Level Bake @ 125°C Bake @ 90°C Bake @ 40°C Bake @ 125°C ≤5% RH ≤5% RH Exceeding Exceeding Exceeding Exceeding Exceeding Exceeding Floor Life Floor Life Floor Life Floor Life Floor Life Floor Life Package Body Level by >72 h by ≤72 h by >72 h by ≤72 h by >72 h by ≤72 h Thickness ≤1.4 mm 2 5 hours 3 hours 17 hours 11 hours 8 days 5 days 2a 7 hours 5 hours 23 hours 13 hours 9 days 7 days 3 9 hours 7 hours 33 hours 23 hours 13 days 9 days 4 11 hours 7 hours 37 hours 23 hours 15 days 9 days 5 12 hours 7 hours 41 hours 24 hours 17 days 10 days 5a 16 hours 10 hours 54 hours 24 hours 22 days 10 days BL702/704/706 Datasheet 34/ 47 @2021 Bouffalo Lab |
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