ES9826 datasheet(86/88 Pages) ESS

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ES9826 Datasheet

VERSION 0.1.2

ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 • WWW.ESSTECH.COM

Reflow is allowed 3 times. Caution must be taken to ensure time between re-flow runs does not exceed the allowed time by

the moisture sensitivity label. If the time elapsed between the re-flows exceeds the moisture sensitivity time bake the board

according to the moisture sensitivity label instructions.

Manual

Allowed up to 2 times with maximum temperature of 350°C no longer than 3 seconds.

RPC-1 Classification reflow profile

Profile Feature

Pb-Free Assembly

Preheat/Soak

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (ts) from (Tsmin to Tsmax)

150°C

200°C

60-120 seconds

Ramp-up rate (TL to Tp)

3°C / second maximum

Liquidous temperature (TL)

Time (tL) maintained above TL

217°C

60-150 seconds

Peak package body temperature (Tp)

For users Tp must not exceed the classification temp in

Table RPC-2.

For suppliers Tp must equal or exceed the Classification

temp in Table RPC-2.

Time (tp)* within 5°C of the specified classification

temperature (Tc)

30* seconds

Ramp-down rate (Tp to TL)

6°C / second maximum

Time 25°C to peak temperature

8 minutes maximum

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

Table 26 – RPC-1 Classification reflow profile

All temperatures refer to the center of the package, measured on the package body surface that is facing up during

assembly reflow (e.g., live-bug). If parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e.,

dead-bug), Tp shall be within ±2°C of the live-bug Tp and still meet the Tc requirements, otherwise, the profile shall be

adjusted to achieve the latter. To accurately measure actual peak package body temperatures, refer to JEP140 for

recommended thermocouple use.

Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles.

Actual board assembly profiles should be developed based on specific process needs and board designs and should not

exceed the parameters in Table RPC-1.

For example, if Tc is 260°C and time tp is 30 seconds, this means the following for the supplier and the user.

For a supplier: The peak temperature must be at least 260°C. The time above 255°C must be at least 30 seconds.

For a user: The peak temperature must not exceed 260°C. The time above 255°C must not exceed 30 seconds.

All components in the test load shall meet the classification profile requirements.

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