NXP Semiconductors

PCA9574

8-bit I2C-bus and SMBus, level translating, low voltage GPIO with reset and interrupt

15 Package outline

UNIT

A1

A2

A3

bp

c

D (1)

E (2)

(1)

e

HE

L

Lp

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.40

0.06

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1

MO-153

99-12-27

03-02-18

w M

bp

D

Z

e

0.25

1

8

16

9

θ

A

A1

A2

Lp

Q

detail X

L

(A )

3

HE

E

c

v M A

X

A

y

0

2.5

5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

A

max.

1.1

pin 1 index

Figure 21. Package outline SOT403-1 (TSSOP16)

PCA9574

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© 2023 NXP B.V. All rights reserved.

Product data sheet

Rev. 6.0 — 31 May 2023

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