MPC850 datasheet(8/72 Pages) FREESCALE

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MPC850 PowerQUICC™ Integrated Communications Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

Thermal Characteristics

Table 3 shows the thermal characteristics for the MPC850.

Table 4 provides power dissipation information.

Table 5 provides the DC electrical characteristics for the MPC850.

Table 3. Thermal Characteristics

Characteristic

Symbol

Value

Unit

Thermal resistance for BGA 1

For more information on the design of thermal vias on multilayer boards and BGA layout considerations in

general, refer to AN-1231/D, Plastic Ball Grid Array Application Note available from your local Freescale sales

office.

θJA

40 2

2 Assumes natural convection and a single layer board (no thermal vias).

°C/W

θJA

31 3

Assumes natural convection, a multilayer board with thermal vias4, 1 watt MPC850 dissipation, and a board

temperature rise of 20

°C above ambient.

°C/W

θJA

24 4

4 Assumes natural convection, a multilayer board with thermal vias4, 1 watt MPC850 dissipation, and a board

temperature rise of 13

°C above ambient.

TJ = TA + (PD

•θJA)

PD = (VDD

• IDD) + PI/O

where:

PI/O is the power dissipation on pins

°C/W

Thermal Resistance for BGA (junction-to-case)

θJC

°C/W

Table 4. Power Dissipation (PD)

Characteristic

Frequency (MHz)

Typical 1

Typical power dissipation is measured at 3.3V

Maximum 2

Maximum power dissipation is measured at 3.65 V

Unit

Power Dissipation

All Revisions

(1:1) Mode

TBD

515

TBD

590

TBD

725

Table 5. DC Electrical Specifications

Characteristic

Symbol

Min

Max

Unit

Operating voltage at 40 MHz or less

VDDH, VDDL,

KAPWR, VDDSYN

3.0

3.6

Operating voltage at 40 MHz or higher

VDDH, VDDL,

KAPWR, VDDSYN

3.135

3.465

Input high voltage (address bus, data bus, EXTAL, EXTCLK,

and all bus control/status signals)

VIH

2.0

3.6

Input high voltage (all general purpose I/O and peripheral pins)

VIH

2.0

5.5

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