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MPC7448 датащи(PDF) 23 Page - Freescale Semiconductor, Inc |
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MPC7448 датащи(HTML) 23 Page - Freescale Semiconductor, Inc |
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23 / 60 page ![]() MPC7448 RISC Microprocessor Hardware Specifications, Rev. 3 Freescale Semiconductor 23 Pin Assignments 5.3 Voltage and Frequency Derating Voltage and frequency derating is no longer supported for part numbers described by this document beginning with datecode 0613. (See Section 11, “Part Numbering and Marking,” for information on date code markings.) It is supported by some MPC7448 part numbers which target low-power applications; see Section 11.2, “Part Numbers Not Fully Addressed by This Document” and the referenced MPC7448 Hardware Specification Addenda for more information on these low-power devices. For those devices which previously supported this feature, information has been archived in the Chip Errata for the MPC7448 (document order no. MPC7448CE). 6 Pin Assignments Figure 12 (in Part A) shows the pinout of the MPC7448, 360 high coefficient of thermal expansion ceramic ball grid array (HCTE) package as viewed from the top surface. Part B shows the side profile of the HCTE package to indicate the direction of the top surface view. A B C D E F G H J K L M N P R T 12 3 4 5 6 78 910 11 12 13 14 15 16 Not to Scale 17 18 19 U V W Part A |
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