604 Hardware Specifications

19

Preliminary/Subject to Change without Notice

1.6 PowerPC 604 Microprocessor Package

Description

The following sections provide the package parameters and the mechanical dimensions for the 604.

1.6.1 C4-CQFP Package Description

The following sections provide the package parameters and mechanical dimensions for the C4-CQFP

package.

1.6.1.1 Motorola C4-CQFP Package Parameters

The package parameters for the Motorola C4-CQFP are as provided in the following list. The package type

is 40 mm, 304-pin ceramic quad flat pack.

Package outline

40 mm

Interconnects

304

Pitch

0.5 mm

Lead plating

Ni Au

C4 encapsulation

Glass-filled Epoxy

Maximum module height

3.25 mm

Co-planarity specification

0.10 mm

1.6.1.2 IBM C4-CQFP Package Parameters

The package parameters for the IBM C4-CQFP are as provided in the following list. The package type is

40 mm, 304-pin ceramic quad flat pack.

Package outline

40 mm

Interconnects

304

Pitch

0.5 mm

Lead plating

Ni Au

Lead encapsulation

Glass-filled Epoxy

C4 encapsulation

Glass-filled Epoxy

Maximum module height

2.92 mm

Co-planarity specification

0.08 mm

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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