FN8975 Rev.4.01

Page 4 of 12

May 4, 2022

ISL70023SEH, ISL73023SEH

2. Specifications

2.

Specifications

2.1

Absolute Maximum Ratings

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such

conditions may adversely impact product reliability and result in failures not covered by warranty.

2.2

ESD Ratings

2.3

Thermal Information

Parameter

Maximum

Unit

VDS (Note 6)

100

V

VGS

-4 to 6

V

Note:

6. Tested in a heavy ion environment at LET = 86.4MeV•cm2/mg at +125°C (TC)

ESD Model/Test

Rating

Unit

Drain-to-Source

Human Body Model (Tested per MIL-STD-883 TM3015)

2

kV

Machine Model (Tested per JESD22-A115C)

200

V

Charged Device Model (Tested per JS-002-2014)

750

V

Gate-to-Source

Human Body Model (Tested per MIL-STD-883 TM3015)

500

V

Machine Model (Tested per JESD22-A115C)

200

V

Charged Device Model (Tested per JS-002-2014)

750

V

ISL70023SEH, ISL70023SEH in SMD Package J4.A

Thermal Resistance

Typical

Maximum

Unit

JA (Note 7)

23.0

°C/W

JC (Note 8)3.1

3.9

°C/W

Notes:

7.

JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach”

features. See TB379.

8. For

JC, the “case temp” location is on the solder terminations adjacent to the center of the package underside.

Parameter

Minimum

Maximum

Unit

Maximum Junction Temperature

-

+150

°C

Storage Temperature Range

-65

+150

°C