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XGS датащи(PDF) 12 Page - ON Semiconductor

номер детали XGS
подробное описание детали  XGS 12000, XGS 9400 and XGS 8000 Global Shutter CMOS Image Sensors
PDF  53 Pages
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

XGS датащи(HTML) 12 Page - ON Semiconductor

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12
Figure 9. Typical Configuration (Two−Wire Serial Interface)
1. All power supplies must be adequately decoupled (see Table 4) Decoupling.
2. In this example, only 2 (out of 6) HiSPi clock lanes are used; D_CLK_2 to sample data on the even data lanes (top readout) and
D_CLK_3 to sample data on the odd data lanes (bottom readout).
3. The active HiSPi lanes need to be terminated using 100 W resistors placed as close to the receiver as possible.
4. Unused HiSPi outputs (data and/or clock lanes) must be left floating.
5. It is highly recommended to route the monitor signals to the receiver (FPGA) for debugging purposes. If the MONITOR outputs
are not used, they must be left floating.
6. If the TRIGGER inputs are not used, tie them to GND.
7. No distinction is made between analog and digital ground (internally shorted).
8. FWSI_EN and CS_N must be tied to GND when using the Two−Wire Serial Interface. Sdataout can be left floating.
9. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
10. Digital input RESET_N is active low.
11. ON Semiconductor recommends using a 1.5 kW pull−up resistor to VDD_IO on both Sclk and Sdata.
C2
C1
VAA
C2
C1
VAA_PIX
C2
C1
VAA_RD
C2
C1
VAA_PIX
_BST
C2
C1
VDD_IO
C2
C1
VDD
C2
C1
VDD_SLVS
C2
C1
VDD_PLL
XGS 12000
XGS 9600
XGS 8000
FWSI_EN
32.4 MHz
EXTCLK
SDATA
SCLK
CS_N
RESET_N
TRIG_INT
TRIG_RD
C3
C3
C3
C3
C3
C3
C4
C4
C4
C4
C4
C4
C5
C5
D_CLK_[2,3]_P
D_CLK_[2,3]_N
DATA_[0:23]_P
DATA_[0:23]_N
MONITOR_0
MONITOR_1
MONITOR_2
SDATAOUT
Digital I/O
(2.8 V)
Digital Core
(1.2 V)
HiSPi
(1.2 V)
PLL
(2.8 V)
Analog
(2.8 V)
Analog (Pixel)
(3.0 V)
100 Ω
100 Ω
RESERVED
N.C.
N.C.



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