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MF4SAM3 датащи(PDF) 19 Page - NXP Semiconductors

номер детали MF4SAM3
подробное описание детали  MIFARE SAM AV3 secure access module
PDF  31 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

MF4SAM3 датащи(HTML) 19 Page - NXP Semiconductors

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NXP Semiconductors
MF4SAM3
MIFARE SAM AV3 secure access module
MF4SAM3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
Rev. 3.0 — 2 August 2019
COMPANY PUBLIC
561930
19 / 31
[2]
At minimum IOx input signal HIGH or LOW level voltage pulse width of 3.2 µs. This timing specification applies to ISO7816 configurations down to a
minimum etu duration of 16 CLK cycles at a maximum CLK frequency of 5 MHz (TA1=0x96, (Fi/Di)=(512/32)), for example.
[3]
At minimum IOx input signal HIGH or LOW level voltage pulse width of less than 3.2 µs. This timing specification applies to ISO7816 configurations
beyond the conditions listed in note [2], down to a minimum etu duration of 8 CLK cycles at a maximum CLK frequency of 5 MHz (TA1=0x97, (Fi/
Di)=(512/64)), for example. An 8 CLKs/etu @ fclk = 5 MHz configuration results in tIOWx_min = 1.6 µs, and in a time of 400 ns for trIO_max and tfIO_max,
matching the (Fi/Di)=(512/64) speed enhancement requirements of ETSI TS 102 221.
[4]
ISO/IEC 7816 I/O applications have to supply a clock signal to input CLK in the frequency range of 1 MHz to 10 MHz nominal. A ± 15 % tolerance range
yields the allowed limits of 0.85 MHz and 11.5 MHz.
[5]
During AC testing the inputs CLK, RST_N, IO1, IO2 and IO3 are driven at 0 V to +0.3 V for a LOW input level and at VDD - 0.3 V to VDD for a HIGH input
level. Clock period and signal pulse (duty cycle) timing is measured at 50% of VDD (see Figure 9).
[6]
The maximum CLK rise and fall time is 10% of the CLK period 1/fCLK - with the following exception: In the CLK frequency range of 1 MHz to 5 MHz the
maximum allowed CLK rise and fall time is 50 ns, if 10% of the CLK period is shorter than 50 ns.
[7]
The ETSI TS102 221/GSM 11.1x specifications specify a maximum reset signal (RST_N) rise time and fall time of 400,000 μs, respectively.
Figure 9. External clock drive and AC test timing reference points of CLK, RST_N, IO1, IO2 and IO3 (see [1] and [2])
[1]
During AC testing the inputs CLK, RST_N, IO1, IO2 and IO3 are driven at 0 V to +0.3 V for a LOW input level and at VDD - 0.3 V to VDD for a HIGH input
level. Clock period and signal pulse (duty cycle) timing is measured at 50% of VDD.
[2]
tr is defined as rise time between 10% and 90% of the signal amplitude.
tf is defined as fall time between 90% and 10% of the signal amplitude.
Table 11. Electrical AC characteristics of TP1 and TP2
Conditions: (A) VDD = 1.62 to 1.98 V: VDDAE = VDD; (B) VDD = 2.2 to 5.5 V (i.e. outside Class C supply range):
VDDAE(nom) = 1.8 V; VSS = 0 V; Tamb = -25 °C to +85 °C, unless otherwise specified
Symbol Parameter
Conditions
Min
Typ
Max
Unit
trTP
TP input rise time
Input/reception mode
-
-
1
μs
tfTP
TP input fall time
Input/reception mode
-
-
1
μs
trOTP
TP output rise time
Output/transmission mode;
C_L = 30 pF
-
-
50
ns
tfOTP
TP output fall time
Output/transmission mode;
C_L = 30 pF
-
-
50
ns
CiTP
Pin characteristics TP1, TP2
Test frequency = 1 MHz;
Tamb = -25 °C
-
-
15
pF



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