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AT25QL321 датащи(PDF) 70 Page - Dialog Semiconductor

номер детали AT25QL321
подробное описание детали  32-Mbit, 1.7V Minimum SPI Serial Flash Memory with Dual I/O, Quad I/O and QPI Support
PDF  79 Pages
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производитель  DIALOG [Dialog Semiconductor]
домашняя страница  http://www.dialog-semiconductor.com/
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AT25QL321 датащи(HTML) 70 Page - Dialog Semiconductor

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69
AT25QL321
DS-25QL321–131C–5/2017
9.
Ordering Information
9.1
Ordering Code Detail
AT 2 5 Q
3 2
S
E
UT
1–
–
L
Designator
Product Family
Device Density
321 = 32-megabit
Package Option
M = 8-pad, 5 x 6 x 0.6 mm UDFN
MB = 8-pad, 3 x 4 x 0.55 mm USON
S = 8-lead, 0.208" wide SOIC
CC = 1 mm pitch BGA
U = 8-ball 0.5mm pitch dBGA
UA = 10-ball 0.35mm pitch dBGA
DWF = Die in Wafer Form
Device Grade
U = Green, Matte Sn or Sn alloy,
Industrial temperature range
(–40°C to +85°C)
H = NiPdAu lead-frame
Industrial Temp range (-40C+85C)
Shipping Carrier Option
T = Tape and reel
Operating Voltage
E =
1.7V to 2.0V
Ordering Code (1) (2)
Package
Lead Finish
Operating
Voltage
Max. Freq.
(MHz)
Operation Range
AT25QL321-MHE-T
8MA1
NiPdAu
1.7V-2.0V
104 MHz
AT25QL321-MBUE-T
8MA2
AT25QL321-SUE-T
8S4
SnAgCu
-40℃ to 85℃
(Industrial
Temperature Range)
AT25QL321-CCUE-T
24CC
AT25QL321-UUE-T(3)
8-WLCSP
AT25QL321-UAUE-T(3)
10-WLCSP
AT25QL321-DWF (3)
DWF
1.
The AT25QL128A is shipped with the QE bit set to 1 enabling the Quad / QPI mode.
2. The shipping carrier option code is not marked on the devices.
3. Contact Adesto for mechanical drawing or sales information.
Package Type
8S4
8-lead, 0.208" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8MA1
8-pad (5 x 6 x 0.6 mm body), Thermally Enhanced Plastic Ultra-Thin Dual Flat No-lead (UDFN)
8MA2
8-pad (3 x 4 x 0.55 mm body), Thermally Enhanced Plastic Ultra-Thin Small Outline No-lead (USON)
24CC
24-ball, 1 mm pitch, Ball Grid Array (BGA)



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