DRAWING NO.

REV.

TITLE

GPC

8U-18

01

4/5/16

8U-18, 8-ball 4x4 Array, Custom Pitch

Wafer Level Chip Scale Package (WLCSP)

GQA

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

TYP

MAX

NOTE

A

0.456

0.495

0.534

A1

—

0.190

—

A2

—

0.305

—

D

Contact Microchip for details.

d1

1.00 BSC

d2

1.40 BSC

E

Contact Microchip for details.

e

0.50 BSC

e1

2.10 BSC

b

—

0.270

—

NC = Not Connected

PIN ASSIGNMENT MATRIX

1

2

3

4

A

B

C

D

n/a

n/a

SCL

n/a

V

CC

WP

n/a

SDA

NC

n/a

n/a

GND

n/a

NC

A

2

n/a

SIDE VIEW

Note: 1. Dimensions are NOT to scale.

2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu.

A

B

C

D

4 3

2 1

E

D

d1

d2

e1

e

-C-

SEATING PLANE

D

C

B

A

1 2

3 4

A

A2

A1

BOTTOM SIDE

0.015 (4X)

A

TOP VIEW

v

d

0.015

C

0.05

C A B

d

m

m

A1 CORNER

A1 CORNER

k

d

b

Note:  For the most current package drawings, please see the Microchip Packaging Specification located at http://

www.microchip.com/packaging.

AT24CM02

Packaging Information

Datasheet

DS20006197C-page 28