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FBSGAM02PR50 датащи(PDF) 1 Page - Efficient Power Conversion Corporation.

номер детали FBSGAM02PR50
подробное описание детали  50 VDC/10 A Radiation-Hardened Multifunction Power Module
PDF  33 Pages
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производитель  EPC-CO [Efficient Power Conversion Corporation.]
домашняя страница  https://epc-co.com/
Logo EPC-CO - Efficient Power Conversion Corporation.

FBSGAM02PR50 датащи(HTML) 1 Page - Efficient Power Conversion Corporation.

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©2020 EPC SPACE
EPC.SPACE
1
FBS-GAM02-P-R50
FBS-GAM02-P-R50
50 VDC/10 A Radiation-Hardened
Multifunction Power Module
Features
• 50 VDC/10 A Fully De-Rated (100 VDC/10 A Capable)
• Integrated FDA10N30 eGaN® Output Power HEMTs
• Four Possible Configurations:
- Single Low-Side Gate Driver
- Single High-Side Gate Driver
- Independent Low- and High-Side Drivers
- Half-Bridge Gate Drivers with Input Shoot-through
Protection
• Internal Shoot-Through Protection
• Internal Power Good Circuitry
• High Speed Switching Capability: 1.0+ MHz
• Rugged Compact Molded SMT Package
• “Pillar” I/O Pads
• eGaN® HEMT Driver Switching Elements
• Rad-Hard/Commercially Screened
• Guaranteed Total Ionizing Dose:
- Rated to 100 kRad
• Single Event:
- SEE immunity for LET of ~83.7 MeV/mg/cm2
with VDS up to 100% of rated Breakdown
• Neutron Fluence:
- Maintains specification up to 1 x 1013 N/cm2
Application
• Power Switches/Actuators
• Single and Multi-Phase Motor Phase Drivers
• Commercial Satellite EPS & Avionics
• High Speed DC-DC Conversion
Description
EPC Space FBS-GAM02-P-R50 Series Radiation-Hardened
Multifunction Power Module incorporates eGaN® switching
power HEMTs with intended end use design within commercial
satellite space environments. These modules include two
output
power switches, two high speed gate drive circuits (consisting
entirely of eGaN® switching elements), two power
Schottky
diode clamp elements with shoot-through prevention logic
(for the Half-Bridge connection) and a +5 VDC gate drive bias
“power good” monitoring circuitry in an innovative, space-
efficient, 18 pin SMT molded epoxy package. Data sheet
parameters are “Post Radiation Effect” guaranteed utilizing
EPC Space 100% Wafer by Wafer eGaN® element Radiation
Hardness-Assurance validated materials. Circuit Design under
US Patent #10,122,274 B2.
Commerce Rated 9A515.x Device.
FBS-GAM02-P-R50 Functional Block Diagram
Shoot-
through/
Disable Logic
1 K
R
VBIAS (4)
(10) TBST
(11) VDD
(12) TOUT
(8) TOS
(13) BOUT
(14) PGND
BCON (15)
TCON (18)
BSTP (16)
TSTP (17)
CBYP
CBOOT
(Pin 9 is NO Connect)
PG (5)
SD (7)
*SD (6)
TIN (2)
BIN (1)
LGND (3)
1 K
Level
Shift
H/S
Gate
Driver
H/S
Gate
Driver
Power
Good
Detection
and Logic


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