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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TLE9461ES датащи(PDF) 13 Page - Infineon Technologies AG |
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TLE9461ES датащи(HTML) 13 Page - Infineon Technologies AG |
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13 / 140 page  Datasheet 13 Rev.1.1 2019-09-27 TLE9461ES Lite CAN SBC Family General Product Characteristics 4.3 Thermal Resistance Table 3 Thermal Resistance1) 1) Not subject to production test, specified by design. Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Junction to Soldering Point Rth(JSP) –14 – K/W Exposed Pad P_4.3.1 Junction to Ambient Rth(JA) –35 – K/W 2) 2) Specified Rth(JA)value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for a power dissipation of 1.5W; the product (chip+package) was simulated on a 76.2x114.3x1.5mm3 with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm C); where applicable a thermal via array under the exposed pad contacted the first inner copper layer and 300mm2 cooling areas on the top layer and bottom layers (70µm). P_4.3.2 |
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