| поискавой системы для электроныых деталей |
|
MPC852T датащи(PDF) 77 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC852T датащи(HTML) 77 Page - Freescale Semiconductor, Inc |
|
77 / 80 page ![]() MPC852T Hardware Specifications, Rev. 3.1 Freescale Semiconductor 77 Mechanical Data and Ordering Information Figure 64. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC852TVRXXX. Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC852TZTXXX. 1. All dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M —1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls. NOTES: |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |