CC3235MODASF datasheet(12/100 Pages) TI1

12 / 100 page

CC3235MODAS, CC3235MODASF

SWRS233 – OCTOBER 2019

www.ti.com

Submit Documentation Feedback

Product Folder Links: CC3235MODAS CC3235MODASF

Terminal Configuration and Functions

4.2

Pin Attributes and Pin Multiplexing

The module makes extensive use of pin multiplexing to accommodate the large number of peripheral

functions in the smallest possible package. To achieve this configuration, pin multiplexing is controlled

using a combination of hardware configuration (at module reset) and register control.

The board and software designers are responsible for the proper pin multiplexing configuration. Hardware

does not ensure that the proper pin multiplexing options are selected for the peripherals or interface mode

used. Table 4-2 and Table 4-2 describes the general pin attributes and presents an overview of pin

multiplexing. All pin multiplexing options are configurable using the pin MUX registers. The following

special considerations apply:

•

All I/Os support drive strengths of 2, 4, and 6 mA. Drive strength is individually configurable for each

pin.

•

All I/Os support 10-μA pullup and pulldown resistors.

•

By default, all I/Os float in the Hibernate state. However, the default state can be changed by SW.

•

All digital I/Os are non fail-safe.

NOTE

If an external device drives a positive voltage to the signal pads and the CC3235MODAx

module is not powered, DC is drawn from the other device. If the drive strength of the

external device is adequate, an unintentional wakeup and boot of the CC3235MODAx

module can occur. To prevent current draw, TI recommends any one of the following

conditions:

•

All devices interfaced to the CC3235MODAx module must be powered from the same

power rail as the chip.

•

Use level shifters between the device and any external devices fed from other

independent rails.

•

The nRESET pin of the CC3235MODAx module must be held low until the VBAT supply

to the module is driven and stable.

•

All GPIO pins default to high impedance unless programmed by the MCU. The

bootloader sets the TDI, TDO, TCK, TMS, and Flash_SPI pins to mode 1. All the other

pins are left in the Hi-Z state.

The ADC inputs are tolerant up to 1.8 V (see Table 5-22 for more details about the usable

range of the ADC). On the other hand, the digital pads can tolerate up to 3.6 V. Hence, take

care to prevent accidental damage to the ADC inputs. TI recommends first disabling the

output buffers of the digital I/Os corresponding to the desired ADC channel (that is,

converted to Hi-Z state), and thereafter disabling the respective pass switches (S7 [Pin 47],

S8 [Pin 48], S9 [Pin 49], and S10 [Pin 50]). For more information, see Table 4-4.

Table 4-1 lists the pin descriptions of the CC3235MODAx module.

CC3235MODASF датащи(PDF) 12 Page - Texas Instruments

CC3235MODASF датащи(HTML) 12 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100

датащи скачать

ссылки URL