CC3235MODASF datasheet(50/100 Pages) TI1

50 / 100 page

CC3235MODAS, CC3235MODASF

SWRS233 – OCTOBER 2019

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Product Folder Links: CC3235MODAS CC3235MODASF

Specifications

(1)

The CC3235MODAS modules are compatible with TI BLE modules using an external RF switch.

(2)

A single antenna configuration is possible using the CC3x35 devices.

(3)

For dual antenna configuration, the antenna placement must be such that isolation between the BLE and WLAN ports is at least 20 dB.

5.16 BLE and WLAN Coexistence Requirements

For proper BLE and WLAN 2.4 GHz radio coexistence, the following requirements must be met:

Table 5-10. BLE/WLAN Coex(1) Isolation Requirement

PARAMETER

Band

MIN

TYP

MAX

UNIT

Port-to-port isolation

Dual antenna configuration(2)

20(3)

(1)

The nRESET pin must be held below 0.6 V for the module to register a reset.

5.17 Reset Requirement

PARAMETER

MIN

TYP

MAX

UNIT

VIH

Operation mode level

0.65 × VBAT

VIL

Shutdown mode level(1)

0.6

Minimum time for nReset low for resetting the module

Tr and Tf

Rise and fall times

µs

(1)

°C/W = degrees Celsius per watt.

(2)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

(3)

m/s = meters per second.

5.18 Thermal Resistance Characteristics for MOB and MON Packages

NO.

PARAMET

DESCRIPTION

°C/W(1) (2)

AIR FLOW (m/s)(3)

RΘJC

Junction-to-case

11.4

N/A

RΘJB

Junction-to-board

8.0

N/A

RΘJA

Junction-to-free air

19.1

Junction-to-moving air

14.7

13.4

12.5

ΨJT

Junction-to-free air

5.4

Junction-to-package top

5.8

6.1

T10

6.5

T11

ΨJB

Junction-to-free air

6.8

T12

Junction-to-board

6.6

T13

6.6

T14

6.5

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