CC3235MODASF datasheet(81/100 Pages) TI1

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CC3235MODAS, CC3235MODASF

www.ti.com

SWRS233 – OCTOBER 2019

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Product Folder Links: CC3235MODAS CC3235MODASF

Applications, Implementation, and Layout

Table 7-1 provides the bill of materials for a typical application using the CC3235MODAx module in

Figure 7-2.

For full operation reference design, see the CC3235MODAx SimpleLink™ and Internet of Things

Hardware Design Files.

Table 7-1. Bill of Materials

QTY

PART

REFERENCE

VALUE

MANUFACTURER

PART NUMBER

DESCRIPTION

C1, C2

0.1 µF

Murata

GRM155R61A104KA01D

Capacitor, ceramic, 0.1 µF, 10 V,

±10%, X5R, 0402

C4, C5

100 µF

Murata

LMK325ABJ107MMHT

Capacitor, ceramic, 100 µF, 10 V,

±20%, X5R, AEC-Q200 Grade 3, 1210

10k

Vishay-Dale

CRCW040210K0JNED

RES, 10k, 5%, 0.063 W, AEC-Q200

Grade 0, 0402

CC1

CC3235MODSF

Texas Instruments

CC3235MODSF12MOBR

SimpleLink™ Wi-Fi® and Internet-of-

Things Module Solution, a Single-Chip

Wireless Dual-Band MCU, MOB0063A

7.2

Device Connection and Layout Fundamentals

7.2.1

Power Supply Decoupling and Bulk Capacitors

Depending upon routing resistors and battery type, TI recommends adding two 100-µF ceramic capacitors

to help provide the peak current drawn by the CC3235MODAx modules.

NOTE

The module enters a brown-out condition whenever the input voltage dips below VBROWN (see

Figure 5-4 and Figure 5-5). This condition must be considered during design of the power

supply routing specifically if operating from a battery. For more details on brown-out

consideration, see Section 5.8.

7.2.2

Reset

The module features an internal RC circuit to reset the device during power ON. The nRESET pin must be

held below 0.6 V for at least 5 ms for the device to successfully reset.

7.2.3

Unused Pins

All unused pins can be left unconnected without the concern of having leakage current.

7.3

PCB Layout Guidelines

This section details the PCB guidelines to speed up the PCB design using the CC3235MODAx. The

integrator of the CC3235MODAx modules must comply with the PCB layout recommendations described

in the following subsections to minimize the risk with regulatory certifications for the FCC, IC/ISED,

ETSI/CE, SRRC, and MIC. Moreover, TI recommends customers follow the guidelines described in this

section to achieve similar performance to that obtained with the TI reference design.

7.3.1

General Layout Recommendations

Ensure that the following general layout recommendations are followed:

•

Have a solid ground plane and ground vias under the module for stable system and thermal

dissipation.

•

Do not run signal traces underneath the module on a layer where the module is mounted.

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