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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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PCF8811U/2DA/1 датащи(PDF) 70 Page - NXP Semiconductors |
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PCF8811U/2DA/1 датащи(HTML) 70 Page - NXP Semiconductors |
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70 / 73 page  2004 May 17 70 Philips Semiconductors Product specification 80 × 128 pixels matrix LCD driver PCF8811 26 TRAY INFORMATION handbook, full pagewidth MGU295 D F E x y A 1,1 x,1 2,1 1,2 1,3 1,y x,y 2,2 3,1 C B Fig.55 Tray details. Table 30 Tray dimensions handbook, halfpage MGW771 PCF8811-1 Fig.56 Tray alignment. The orientation of the IC in a pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left corner of the tray. Refer to the bonding pad location diagram for the orientation and position of the type name on the die surface. DIM. DESCRIPTION VALUE A pocket pitch; x direction 13.77 mm B pocket pitch; y direction 4.45 mm C pocket width; x direction 12.55 mm D pocket width; y direction 2.41 mm E tray width; x direction 50.80 mm F tray width; y direction 50.80 mm x number of pockets in x direction 3 y number of pockets in y direction 10 |
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