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PCF8811U/2DA/1 датащи(PDF) 62 Page - NXP Semiconductors

номер детали PCF8811U/2DA/1
подробное описание детали  80 x 128 pixels matrix LCD driver
PDF  73 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCF8811U/2DA/1 датащи(HTML) 62 Page - NXP Semiconductors

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2004 May 17
62
Philips Semiconductors
Product specification
80
× 128 pixels matrix LCD driver
PCF8811
23 CHIP INFORMATION
The PCF8811 is manufactured in n-well CMOS technology. The substrate is at VSS potential.
24 BONDING PAD LOCATIONS
Table 28 Bonding pad information
PAD
ROWS/COLS SIDE
INTERFACE SIDE
UNIT
Pad pitch
min. 51.84
min. 54
µm
Pad size (aluminium)
42.84
× 105
50
× 100
µm
Bump dimensions
31.9
× 100 × 17.5 (±5)
34
× 95 × 17.5 (±5)
µm
Wafer thickness (excluding
bumps)
381 (
±25)
µm
handbook, halfpage
MGW767
12.45 mm
2.31
mm
PCF8811
x
y
pitch
Fig.51 Chip size and pad pitch.
MGW768
handbook, halfpage
x center
y center
90
µm
Fig.52 Shape of alignment mark (90
µm diameter).



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