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DM562AP
V.90 Integrated Data/ Fax/Voice/Speakerphone
Modem Device Single Chip with Memory Built in
Preliminary
47
Version: DM562AP-DS-P02
March 05, 2004
LQFP 48L (F.P. 2mm) Outline Dimensions
unit: inches/mm
y
Symbol
Dimensions in inches
Dimensions in mm
Min.
Nom.
Max.
Min.
Nom.
Max.
A
-
-
0.063
-
-
1.60
A1
0.002
-
0.006
0.05
-
0.15
A2
0.053
0.055
0.057
1.35
1.40
1.45
b
0.007
0.009
0.011
0.17
0.22
0.27
b1
0.007
0.008
0.009
0.17
0.20
0.23
C
0.004
-
0.008
0.09
-
0.20
C1
0.004
-
0.006
0.09
-
0.16
D
0.354BSC
9.00BSC
D1
0.276BSC
7.00BSC
E
0.354BSC
9.00BSC
E1
0.276BSC
7.00BSC
e
0.020BSC
0.50BSC
L
0.018
0.024
0.030
0.45
0.60
0.75
L1
0.039REF
1.00REF
y
0.003MAX
0.08MAX
Θ
0-12°
0-12°
Notes:
1.To be determined at seating plane.
2.Dimensions D1 and E 1do not include mold
protrusion. D1 and E1 are maximum plastic
body
size
dimensions
including
mold
mismatch.
3.Dimensions b does not include dambar
protrusion. Total in excess of the b dimension
at maximum material condition. Dambar
cannot be located on the lower radius of the
foot.
4.Exact shape of each corner is optional.
5.These dimensions apply to the flat section of
the lead between 0.10mm and 0.25mm from
the lead tip.
6.A1 is defined as the distance from the seating
plane to the lowest point of the package body.
7.Controlling dimension: millimeter.
8.Reference documents: JEDEC MS-026, BBC.
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