25

TMP112

www.ti.com

SBOS473F – MARCH 2009 – REVISED FEBRUARY 2018

Product Folder Links: TMP112

Submit Documentation Feedback

Copyright © 2009–2018, Texas Instruments Incorporated

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

•

TMP102 Low-Power Digital Temperature Sensor With SMBus and Two-Wire Serial Interface in SOT563

(SBOS397)

•

TMPx75 Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75 Form Factor and

Pinout (SBOS288)

•

TMP275 ±0.5°C Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75 Form Factor

and Pinout (SBOS363)

•

Ultralow Power Multi-Sensor Data Logger With NFC Interface Design Guide

•

Capacitive-Based Human Proximity Detection for System Wake-Up & Interrupt Design Guide

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

SMBus is a trademark of Intel, Inc.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.