AD9671EBZ datasheet(13/61 Pages) AD

13 / 61 page

AD9675

Data Sheet

Rev. A | Page 12 of 60

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

AVDD1 to GND

−0.3 V to +2.0 V

AVDD2 to GND

−0.3 V to +3.9 V

DVDD to GND

−0.3 V to +2.0 V

DRVDD to GND

−0.3 V to +2.0 V

GND to GND

−0.3 V to +0.3 V

AVDD2 to AVDD1

−2.0 V to +3.9 V

AVDD1 to DRVDD

−2.0 V to +2.0 V

AVDD2 to DRVDD

−2.0 V to +3.9 V

SERDOUTx+, SERDOUTx−, SDIO, PDWN,

STBY, SCLK, CSB, ADDRx to GND

−0.3 V to DRVDD + 0.3 V

LI-x, LO-x, LOSW-x, CWI−, CWI+,

CWQ−, CWQ+, GAIN+, GAIN−,

RESET+, RESET−, MLO+, MLO−,

GPO0, GPO1, GPO2, GPO3 to GND

−0.3 V to AVDD2 + 0.3 V

CLK+, CLK−, TX_TRIG+, TX_TRIG−,

VREF to GND

−0.3 V to AVDD1 + 0.3 V

Operating Temperature Range

(Ambient)

0°C to 85°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

Maximum Junction Temperature

150°C

Lead Temperature (Soldering, 10 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL IMPEDANCE

Table 5.

Symbol

Description

Value1

Unit



Junction-to-ambient thermal

resistance, 0.0 m/sec air flow per

JEDEC JESD51-2 (still air)

22.0

°C/W



Junction-to-board thermal

characterization parameter, 0 m/sec

air flow per JEDEC JESD51-8 (still air)

9.2

°C/W



Junction-to-top-of-package

characterization parameter, 0 m/sec

air flow per JEDEC JESD51-2 (still air)

0.12

°C/W

1 Results are from simulations. Printed circuit board (PCB) is JEDEC multilayer.

Thermal performance for actual applications requires careful inspection of

the conditions in the application to determine if they are similar to those

assumed in these calculations.

ESD CAUTION

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