AD5560JSVUZ datasheet(65/67 Pages) AD

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AD5560JSVUZ датащи(PDF) 65 Page - Analog Devices

номер детали	AD5560JSVUZ

подробное описание детали	1.2 A Programmable Device Power Supply

PDF	67 Pages

Scroll/Zoom	100%

производитель	AD [Analog Devices]

домашняя страница	http://www.analog.com

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65 / 67 page

AD5560

Data Sheet

Rev. E | Page 64 of 66

TEMPERATURE CONTOUR MAP ON THE TOP OF THE PACKAGE

TQFP_EP Package

Due to localized heating, temperature at the top surface of

the package has steep gradient. Thus, the θJC value is highly

dependent on where the case temperature is measured.

Figure 62 shows the top of the die temperature contour map

for the TQFP_EP.

BGA Package

Due to localized heating, temperature at the top surface of

the package has steep gradient. Thus, the θJC value is highly

dependent on where the case temperature is measured.

Figure 63 shows the top of the die temperature contour map

for the flip chip BGA.

Figure 62. Temperature Contour Map for 64-Lead TQFP_EP

Figure 63. Temperature Contour Map for the Flip Chip BGA

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