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LPC2131 датащи(PDF) 29 Page - NXP Semiconductors |
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LPC2131 датащи(HTML) 29 Page - NXP Semiconductors |
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29 / 41 page ![]() 9397 750 14868 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 02 — 15 April 2005 29 of 41 Philips Semiconductors LPC2131/2132/2134/2136/2138 Single-chip 16/32-bit microcontrollers 7. Limiting values [1] The following applies to the Limiting values: a) Stresses above those listed under Limiting values may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in Section 8 “Static characteristics”and Section 9 “Dynamic characteristics” of this specification is not implied. b) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. c) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode. [3] Only valid when the VDD supply voltage is present. [4] Not to exceed 4.6 V. [5] The peak current is limited to 25 times the corresponding maximum current. [6] Dependent on package type. Table 9: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Symbol Parameter Conditions Min Max Unit VDD supply voltage, core and external rail −0.5 +3.6 V VDDA analog 3.3 V pad supply voltage −0.5 4.6 V VBAT RTC power supply voltage −0.5 4.6 V VREF A/D converter reference voltage −0.5 4.6 V VIA analog input voltage on A/D related pins −0.5 5.1 V VI DC input voltage, 5 V tolerant I/O pins [2] [3] −0.5 6.0 V VI DC input voltage, other I/O pins [2] −0.5 VDD + 0.5 [4] V IDD DC supply current per supply pin - 100 [5] mA ISS DC ground current per ground pin - 100 [5] mA Tstg storage temperature [6] −40 125 °C Ptot(pack) total power dissipation based on package heat transfer, not device power consumption - 1.5 W |
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