AD9684 datasheet(17/65 Pages) AD

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AD9684

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD1 to AGND

1.32 V

AVDD2 to AGND

2.75 V

AVDD3 to AGND

3.63 V

DVDD to DGND

1.32 V

DRVDD to DRGND

1.32 V

SPIVDD to AGND

3.63 V

AGND to DRGND

−0.3 V to +0.3 V

VIN±x to AGND

3.2 V

SCLK, SDIO, CSB to AGND

−0.3 V to SPIVDD + 0.3 V

VIN±x Maximum Swing

4.3 V p-p

PDWN/STBY to AGND

−0.3 V to SPIVDD + 0.3 V

Environmental

Operating Temperature Range

(TCASE)

−40°C to +85°C

Maximum Junction Temperature

125°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

Typical θJA, θJB, and θJC are specified vs. the number of printed

circuit board (PCB) layers in different airflow velocities (in

m/sec). Airflow increases heat dissipation effectively reducing

θJA and θJB. The use of appropriate thermal management

techniques is recommended to ensure that the maximum

junction temperature does not exceed the limits shown in Table 7.

Table 7. Simulated Thermal Data

PCB

Type

Airflow

Velocity

(m/sec)

θJA

θJB

θJC_TOP

θJC_BOT

Unit

JEDEC

2s2p

Board

0.0

17.81,2

6.31,3

4.71,5

1.21,5

°C/W

1.0

15.61,2

5.91,3

N/A4

°C/W

2.5

15.01,2

5.71,3

N/A4

°C/W

10-Layer

PCB

0.0

13.8

4.6

4.7

1.2

°C/W

1.0

12.7

4.6

N/A4

°C/W

2.5

12.0

4.6

N/A4

°C/W

Per JEDEC 51-7, plus JEDEC 51-5 2s2p test board.

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

Per JEDEC JESD51-8 (still air).

N/A means not applicable.

Per MIL-STD 883, Method 1012.1.

ESD CAUTION

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