Reflow Solder Profile

For infrared or conventional soldering, the solder profile has to follow the recommendations of IPC/JEDEC J-STD020C (revision C and

Tape & Reel Information

The devices are packaged into embossed tapes for automatic placement systems. The tape is wound on 178mm (7inch) or 330mm

(13inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate datasheet and

indicate the tape size for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association

EIA-Standard 481-1, 481-2, 481-3.

LST

27.07.2011

Page 1

File:

This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission

.

Raster 2.5mm

2.5mm

4mm

Pin 1 / Solder balls bottom side

Figure 9: Tape dimensions

epc does not guarantee that there are no empty cavities in the tape. Thus, the pick-and-place machine should check the presence of a

chip during picking.

Ordering information

Part number

Part name

Package

RoHS compliance

Packaging method

P100 037

epc600-CSP24

CSP24

Yes

Reel

Table 5: Ordering information

© 2014 ESPROS Photonics Corporation

Characteristics subject to change without notice

8 / 30

Datasheet epc600 - V1.3

www.espros.ch