Layout information

CSP-24 Package (all measures in mm,

<Partname>

<x000 000>

<Name>

<Data>

M 1:1

DIN A4

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Part Name

Part No.

Designed

Approved

Scale

Page

File:

1

26.02.2009

)

0.450

0.200

0.450

2.76 +0.00/-0.16

1.325

Photosensitive area

on the backside of the chip

Circuit side (Frontside)

Pin 1

Solder balls

Sn97.5Ag2.5

0.320

0.450

0.150

2.650 ±0.1

Pin 1

∅ 0.300

0.450

no solder stop inside this area

Via GND

min. ∅ 1.00

Solder stop

∅ 1.40

Hole

∅ 0.50 - 0.60

0.200

Figure 6: Mechanical dimensions

Figure 7: Layout recommendation

Recommendations for a strong ground connection and for reliable soldering of solder balls:

■ Use a pad layout similar to Figure 7. Notice, all tracks should go underneath the solder mask areas.

■ To keep the noise floor low in the sensitive receiver path of the chip, a low ohmic and low inductive connection to the supply ground is

needed. Figure 7 suggests a recommended grounding of the chip (if a ground plane is not feasible):

Feed all grounds into a central via-hole with a drill diameter 0.5 - 0.60mm.

■ No additional connects to any pins inside of the opening of the solder mask.

■ The open via underneath the chip must be covered with a solder-stop lid, to prevent ascending solder during the soldering process.

■ Refer also to our application note AN04 and AN08 Assembly of Wafer Level Chip Scale (WL-CSP) Packages.

Design precautions

The sensitivity of the sensor area is very high in order to achieve a long operational range of the range-finder. Thus, the epc600 device is

very sensitive to EMI. Special care should be taken to keep the chip away from the IR LED signal tracks and other sources which may in -

duce unwanted signals.

ESD protection

Highly sensitive CMOS mixed signal devices are sensible to electrostatic discharge (ESD). Figure 8 shows the principle how each pin of

the chip is protected against ESD over-voltages by the corresponding safety elements.

GNDA

GNDLED

GNDPLL

GND

LED

NC3

LEDF

XTAL1

XTAL2

VDDCORE

SDATA

SCLK

HLLED/NC2

NC1

GNDM

VDDT

epc600

Figure 8: ESD protection of the pins

© 2014 ESPROS Photonics Corporation

Characteristics subject to change without notice

7 / 30

Datasheet epc600 - V1.3

www.espros.ch