STM32L062T8 datasheet(117/118 Pages) STMICROELECTRONICS

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STM32L062x8

Revision history

117

11-Mar-2016

Updated number of SPIs on cover page and in Table 1: Ultra-low-power

STM32L062x8 device features and peripheral counts.

Changed minimum comparator supply voltage to 1.65 V on cover page.

Added number of fast and standard channels in Section 3.11: Analog-

to-digital converter (ADC).

Updated Section 3.19.2: Universal synchronous/asynchronous receiver

transmitter (USART) and Section 3.19.4: Serial peripheral interface

(SPI)/Inter-integrated sound (I2S) to mention the fact that USARTs with

synchronous mode feature can be used as SPI master interfaces.

Added baudrate allowing to wake up the MCU from Stop mode in

Section 3.19.2: Universal synchronous/asynchronous receiver

transmitter (USART).

Section 6.3.15: 12-bit ADC characteristics:

– Table 55: ADC characteristics:

Distinction made between VDDA for fast and standard channels;

added note 1.

Added note 4. related to RADC.

Updated tS and tCONV.

– Updated equation 1 description.

– Updated Table 56: RAIN max for fADC = 16 MHz for fADC = 16 MHz

and distinction made between fast and standard channels.

Updated RO and added Note 1. in Table 58: DAC characteristics.

Added Table 65: USART/LPUART characteristics.

09-Jun-2016

Added WLCSP36 package, STM32L062T8 part number and

corresponding features.

07-Mar-2017

Added thin WLCSP36 package.

In Section 4: Pin descriptions, renamed USB_OE into USB_NOE.

Added mission profile compliance with JEDEC JESD47 in Section 6.2:

Absolute maximum ratings.

Added note 2. related to the position of the external capacitor below

Figure 22: Recommended NRST pin protection.

Updated RL in Table 55: ADC characteristics.

Updated tAF maximum value for range 1 in Table 64: I2C analog filter

characteristics.

Updated tWUUSART description in Table 65: USART/LPUART

characteristics.

NSS timing waveforms updated in Figure 28: SPI timing diagram -

slave mode and CPHA = 0 and Figure 29: SPI timing diagram - slave

mode and CPHA = 1(1).

Added reference to optional marking or inset/upset marks in all

package device marking sections.

Previous WLCSP36 package renamed “Standard” WLCSP36; added

Note 2. below Figure 32: Standard WLCSP36 - 2.61 x 2.88 mm,

0.4 mm pitch wafer level chip scale package outline and updated

Table 72: Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer

level chip scale mechanical data.

Table 80. Document revision history (continued)

Date

Revision

Changes

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