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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TMP93CS41DF датащи(PDF) 21 Page - Toshiba Semiconductor |
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TMP93CS41DF датащи(HTML) 21 Page - Toshiba Semiconductor |
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21 / 48 page  Quality and Reliability Assurance / Handling Precautions 030901 QUA-21 2002-02-20 Table 2.8 Storage conditions, permissible usage Period after unpacking and baking requirements for each soldering method (3/3) Products Name Package no. Air reflow Infrared reflow TMP47C660AF P-QFP64-1420-1.00A A(168h) A(168h) TMP47C860AF P-QFP64-1420-1.00A A(168h) A(168h) TMP47P860VF P-QFP64-1420-1.00A GG TMP47C1220F P-QFP80-1420-0.80B A(168h) A(168h) TMP47C1620F P-QFP80-1420-0.80B A(168h) A(168h) TMP47P1620VF P-QFP80-1420-0.80B B(72h) B(72h) TMP47C1260F P-QFP64-1420-1.00A A(168h) A(168h) TMP47C1660F P-QFP64-1420-1.00A A(168h) A(168h) TMP47P1660VF P-QFP64-1420-1.00A B(72h) B(72h) Note 1: As of March, 2001 Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and indicate the maximum permissible period between unpacking and mounting of the device, and the required storage conditions for the device. For details of these conditions, please refer to Table 2.2. |
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