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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TMP93CS41DF датащи(PDF) 5 Page - Toshiba Semiconductor |
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TMP93CS41DF датащи(HTML) 5 Page - Toshiba Semiconductor |
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5 / 48 page  Quality and Reliability Assurance / Handling Precautions 030901 QUA-5 2002-02-20 2 Handling Precautions for Microcontrollers 2.1 Mounting Precautions Plastics have basically porous feature. When a chip (especially an SMD which has a thin plastic surface) is heated in a state of moisturized and is soldered by the reflow soldering method, moisture is vaporized as the temperature rises to cause a package expanded. Or a borderd surface between a lead frame and a plastic material is peeled off to cause a crack. These bring serious troubles on reliability. In order to prevent hygroscopity or enable high heat treatment after absorbing moisture, Toshiba uses a dampproof packing and/or a heat proof tray. (1) Recommended Methods of Soldering for Flat Packages • Table 2.1 lists the recommended method of soldering flat packages. If you have any question or request, please refer to “IC PACKAGE MANUAL” or contact your local offices. • For overall heating method, recommended mounting methods and conditions after opening the pack differ depending on products to be used. See Table 2.2 and 2.3 for the details. • For locally heating a lead part, soldering iron method is recommended. For other localized heating methods, refer to “IC PACKAGE MANUAL” or contact your Toshiba local offices. |
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