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TMP93CS41DF датащи(PDF) 15 Page - Toshiba Semiconductor

номер детали TMP93CS41DF
подробное описание детали  Quality And Reliability Assurance / Handling Precautions
PDF  48 Pages
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
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TMP93CS41DF датащи(HTML) 15 Page - Toshiba Semiconductor

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Quality and Reliability Assurance / Handling Precautions
030901
QUA-15
2002-02-20
Table 2.5
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (2/3)
Products
Name
Air reflow
Infrared reflow
TMP87CH38F
A(168h)
A(168h)
TMP87CK38F
A(168h)
A(168h)
TMP87CM38F
D(24h)
D(24h)
TMP87CP38F
D(24h)
D(24h)
TMP87CS38F
A(168h)
A(168h)
TMP87PS38F

TMP87CM39F
A(168h)
A(168h)
TMP87CP39F
A(168h)
A(168h)
TMP87CS39F
A(168h)
A(168h)
TMP87PS39F

TMPA8700CHF
A(168h)
A(168h)
TMPA8700CKF
A(168h)
A(168h)
TMPA8700CMF
A(168h)
A(168h)
TMPA8700CPF
A(168h)
A(168h)
TMPA8700CSF
A(168h)
A(168h)
TMPA8700PSF

TMPA8701CHF
A(168h)
A(168h)
TMPA8701CKF
A(168h)
A(168h)
TMPA8701CMF
A(168h)
A(168h)
TMP87C840F
A(168h)
A(168h)
TMP87CC40F
A(168h)
A(168h)
TMP87CH40F
A(168h)
A(168h)
TMP87PH40AF
B(72h)
B(72h)
TMP87CK40AF
A(168h)
A(168h)
TMP87CK40F
A(168h)
A(168h)
TMP87CM40AF
A(168h)
A(168h)
TMP87PM40AF
B(72h)
B(72h)
TMP87C841F
A(168h)
A(168h)
TMP87CC41F
A(168h)
A(168h)
TMP87CH41F
A(168h)
A(168h)
TMP87CK41F
A(168h)
A(168h)
TMP87CM41F
A(168h)
A(168h)
TMP87PM41F
A(168h)
A(168h)
TMP87C841U
A(168h)
A(168h)
TMP87CC41U
A(168h)
A(168h)
TMP87CH41U
A(168h)
A(168h)
TMP87CK41U
A(168h)
A(168h)
TMP87CM41U
A(168h)
A(168h)
TMP87PM41U
A(168h)
A(168h)
TMP87C447U
A(168h)
A(168h)
TMP87C847U
A(168h)
A(168h)
TMP87C847LU
A(168h)
A(168h)
TMP87CH47U
A(168h)
A(168h)
TMP87CH47LU
A(168h)
A(168h)
TMP87PH47U
A(168h)
A(168h)
TMP87PH47LU
A(168h)
A(168h)
TMP87CH48U
A(168h)
A(168h)
Note 1:
As of March, 2001
Note 2:
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G and indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device.
For
details of these conditions, please refer to Table 2.2.



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