DDP3310B datasheet(45/60 Pages) MICRONAS

45 / 60 page

ADVANCE INFORMATION

DDP 3310B

Micronas

4.6.3. Recommended Crystal Characteristics

4.6.4. Characteristics

Min./Max. values at: TA = 0 to 65 °C, VSUP(P/D/O) = 4.75 to 5.25 V, Rxref = 10 kΩ, f = 27 MHz

Typical values at:

TC = 70 °C,

VSUP(P/D/O) = 5 V,

Rxref = 10 kΩ, f = 27 MHz

4.6.4.1. General Characteristics

Symbol

Parameter

Pin Name

Min.

Typ.

Max.

Unit

Parallel Resonance Frequency

@ CL=16 pF

XTAL1

XTAL2

−

MHz

Series Resonance Resistance

@CL=16 pF, fP=5 MHz

−−

150

Ω

Shunt (Parallel) Capacitance

−−

6pF

CLext

see

Remarks!

External Load Capacitances (from both

crystal pins connected to GNDD)

−

Remarks:

External capacitors at each crystal pin to ground are required. They are necessary to tune the effective load

capacitance (including the capacitance of the printed circuit board and the IC package) to the required load

capacitance CL of the crystal. A higher capacitance will result in a lower clock frequency. The exact value of the

matching capacitor should be determined in the actual application (PCB layout).

CLext = 2 (CL − CPCB − CPACK)

Symbol

Parameter

Pin Name

Min.

Typ.

Max.

Unit

IVSUPO

Current Consumption

Analog Back-end

VSUPO

−

IVSUPD

Current Consumption

Digital Processing

VSUPD

−

225

−

IVSUPP

Current Consumption

Output Pin Driver

VSUPP

−

PTOT

Total Power Dissipation

−

1.5

−

Input and Output Leakage Current

(if not otherwise specified)

−−

0.1

µA

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